This English-language master's degree offers a forward-looking education in the design, fabrication and testing of integrated circuits. The curriculum is deliberately structured so that early theoretical courses build a solid foundation, which then enables students to tackle more hands-on, practice-oriented modules. Teaching is delivered by researchers who are actively working in the field, linking current scientific and industrial developments to the course content.
Core compulsory subjects cover transistor- and system-level design as well as manufacturing and reliability topics, ensuring a broad technical base. After completing these required modules, students can focus their studies through a range of specialization options and applied projects that reinforce practical skills and real-world problem solving. The program concludes with an individual Master’s thesis completed in the final semester.
Program structure and requirements (key facts)
Overview
The curriculum combines a compact set of compulsory core courses (37 CP) with a flexible elective catalogue (53 CP) across three thematic fields, plus practice-oriented options, comprehensive modules and a compulsory 30 CP master’s thesis in the final semester. Courses mix lectures, seminars and hands-on labs, emphasizing both transistor-level circuit design and methods for test, verification and reliability of micro- and nanosystems. Several modules run across semesters 1 and 2 to give continuity in topics such as technologies and reliability of micro/nano systems.
Core modules cover digital system design, heterogeneous system integration, testing of digital and mixed-signal circuits, transistor-level IC design, and foundational elements and technologies for micro- and nano-scale devices. Learning outcomes include the ability to design and verify digital and mixed-signal integrated circuits, perform transistor-level circuit implementation, apply micro/nano fabrication and characterization methods, and assess and improve device reliability.
Electives let you specialize in Test & Reliability, Design & Technology, or Applications of Integrated Circuits. Typical elective topics include modern microscopy and failure analysis for reliability work; semiconductor physics, advanced IC processes and microsystems design for technology-focused tracks; and data-processing architectures, multisensor systems, DSP and programming/data analysis for application-driven roles. At least one practice-oriented module (e.g., a research internship or applied circuit design lab) is required to ensure substantial hands-on experience. The programme concludes with comprehensive modules to broaden methods and a 30 CP master’s thesis.
Key requirements (concise)
Compulsory subjects – 37 CP
Elective subjects — earn 53 CP from the following catalogue (choose across fields)
Field of Test and Reliability
Field of Design and Technology
Field of Application of Integrated Circuits
Practice-oriented modules (at least one must be chosen)
Comprehensive modules
Master’s thesis (compulsory, final semester) – 30 CP
Learning outcomes summary (what you will gain)
This master's program requires a completed undergraduate degree in a closely related engineering field. Applicants who do not hold the specified Chemnitz degree can still be considered if their prior qualification is judged to be comparable.
Equivalency is determined on a case-by-case basis by the board of examiners, so you should be prepared to submit full documentation of your prior studies and course content for review. International applicants with similar electrical engineering or information technology degrees are encouraged to apply; the board will assess whether their qualifications meet the program's entry standards.
If you are unsure whether your degree qualifies, contact the admissions office or the board of examiners early to clarify documentation requirements and the evaluation process.
Admission requirements
Winter Semester (International)
15 July 2026
Summer Semester (International)
15 January 2027
Winter Semester (EU/EEA)
15 July 2026
Summer Semester (EU/EEA)
15 January 2027
Graduates are prepared for technical roles in IC design, test and verification, reliability engineering, failure analysis and microsystems development. The programme's combination of transistor-level design, mixed-signal testing, layout and hands-on labs equips students for positions in semiconductor companies, automotive electronics, telecommunications, sensor and medical-device industries, and test houses.
With its research internship and thesis components, the degree also opens paths into R&D and doctoral studies. Alumni can work as IC designers, test engineers, process and reliability engineers, layout engineers, or pursue further academic research in micro- and nano-systems.
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