This program combines core microelectronics engineering with practical know-how in device fabrication, packaging and systems integration. You will study the fundamentals and real-world applications of analogue and digital circuits, alongside the basic principles behind semiconductor fabrication and device miniaturisation. Courses on microsystems and sensor technology give both an analytical understanding and hands-on exposure to MEMS fabrication processes and microsensor design.
The curriculum continues into advanced semiconductor topics such as thermal processing and lithography, showing how physical principles determine device function. Packaging modules cover electronic assembly techniques and the production of printed circuit boards and interposers, then apply those basics to full microelectronic devices and systems. Throughout, emphasis is placed on translating theory into practical engineering outcomes.
Complementing the technical training, the program includes business and management subjects: operations and logistics (from historical context and subsystem characteristics to advanced optimisation methods and lot-sizing models), project management with strategic and practical perspectives, and investment & financing fundamentals covering investment planning, risk and corporate finance. This mix prepares graduates to address both the engineering challenges and the operational/financial decisions typical in the semiconductor and microelectronics industries.
Typical application information — confirm exact details with the university:
This master's is built as a modular program that is normally delivered and completed in sequence, though some modules may be taught in block-format intensives. Practical work is an explicit component: laboratory exercises take place in the Dresden International University (DIU) labs, so you will apply theoretical content in hands-on settings. The full concept comprises eight modules in total, concluding with a Master's thesis.
Four of the modules focus on contemporary electronic engineering topics relevant to microelectronics, while three modules cover core management areas—operations and logistics management, investment and financing, and project management. After completing these seven taught modules, students undertake the Master's thesis. The curriculum is structured to amount to 60 credits in total.
Learning outcomes emphasize both technical depth and management competence: you will gain advanced knowledge in modern electronic engineering and practical laboratory skills, plus foundations in operations, supply-chain thinking, financial decision-making, and project leadership. The programme culminates in the thesis, demonstrating your ability to carry out independent research or an application-driven project and to integrate engineering and management perspectives.
Requirements / programme structure (key points)
This program expects applicants to hold a solid technical bachelor’s background and to bring both strong academic results and some professional experience. International applicants should note the degree and credit requirement, the academic threshold, and the programme’s emphasis on intercultural motivation when preparing their application materials.
If your national grading system differs from the one used here, be prepared to explain or convert your scores; likewise, you will need to document any claimed work experience and your interest in international/intercultural engagement.
Admission requirements (bullet points)
Winter Semester (International)
30 August 2026
Winter Semester (EU/EEA)
30 August 2026
Graduates are prepared for technical and managerial roles within the microelectronics and semiconductor industry, such as positions in device/process development, packaging and assembly, production and operations management, and supply chain/logistics roles specific to electronic manufacturing. The combination of engineering depth and management training also suits careers in project management, technical sales, and product development management.
With practical lab experience and a research-focused master’s thesis, alumni are also positioned to pursue R&D roles or further academic study in topics related to semiconductor technology, microsystems and electronics manufacturing.
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