Overview
This English-language joint Master of Science programme, offered collaboratively by Nanyang Technological University (NTU) and Technical University of Munich (TUM), prepares students for technical and leadership roles in the fast-moving semiconductor and integrated-circuit (IC) industries. Course work spans analogue, digital and mixed-signal circuit design, IC architecture, and design methodology and automation, while also covering manufacturing and test considerations. Core signal-processing concepts — central to modern communications circuits — are integrated into the curriculum to connect device- and circuit-level work with system applications.
The programme combines theoretical instruction with practical, lab-based learning and industry-oriented training. Students gain exposure to non-technical but career-critical topics such as product marketing, international management, patent law and cultural/globalisation issues; many of these are taught by experienced practitioners from industry partners. On successful completion, graduates receive a joint Master’s degree awarded by NTU and TUM.
Programme structure and requirements
Important note
This program combines an intensive taught phase with a substantial industry and research component. All taught coursework — a mix of theoretical and practical modules — is delivered during the first two semesters in Singapore in cooperation with partner university Nanyang Technological University (NTU). Instruction is entirely in English and the teaching team includes lecturers from both Germany and Singapore, giving a bilingual academic perspective and an international classroom environment.
Following the classroom phase, students complete a mandatory internship with an industrial partner and then undertake a six-month Master’s thesis. This sequence is designed to translate classroom learning into hands-on experience and to develop independent research or development skills required for advanced roles in industry or further academic work. International students should expect a strong emphasis on applied learning, cross-border collaboration, and networking with industry and academic experts.
Key components / requirements
Applicants should hold a bachelor’s degree in Electrical or Electronics Engineering—or in a closely related discipline—and must have achieved a strong academic record during their undergraduate studies. The program looks for candidates with excellent grades and a solid foundation in relevant engineering topics that prepare them for advanced coursework in integrated circuit design.
If your bachelor’s degree was awarded by a university in China, Vietnam, or India, you must obtain an APS (Akademische Prüfstelle) certificate. The APS is an official academic verification issued by the German evaluation authorities; it confirms the authenticity and equivalence of your degree and is typically required before a university can accept your application. Start the APS process early, since it can take additional time to complete.
Winter Semester (International)
31 March 2026
Winter Semester (EU/EEA)
31 March 2026
Graduates are prepared for technical and leadership roles across the semiconductor value chain, including IC design engineer (analogue, digital, mixed-signal), SoC architect, test and validation engineer, packaging and manufacturing roles, and positions in product management or technology commercialisation. The programme’s industry-focused labs, mandatory internship and the joint NTU–TUM credential enhance employability with global semiconductor companies, design houses and start-ups.
Alumni may also pursue research roles or further study (PhD) in microelectronics, nano-electronics and related fields. The mix of technical depth and non-technical modules (e.g., IP and marketing) supports career paths that bridge engineering and business functions within technology companies.
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